Electrodeposition of nano tin film on different substrates in a choline chloride–ethylene glycol deep eutectic solvent containing boric acid

Document Type : Original Research Article

Authors

Department of Chemistry, College of Science, University of Kerbala, Karbala, Iraq

Abstract

In recent years, Tin has been used in coating of medical and orthopedic instruments, probes, alignment devices, implants and surgical cutting tools. This study examines the electrodeposition of nano tin film on several substrates, including brass, copper, and mild steel, while using a ChCl: EG-based liquid which also contained boric acid. It was found that adding larger amounts of boric acid improved the conductivities of Sn electrolytes; when boric acid was introduced to them, the redox current peaks of Sn decreased with increasing concentrations of boric acid and displayed negative shifts in the deposition peak when performing cyclic voltammetry. SEM was involved to examine the morphologies of Sn deposits. Boric acid was found to improve the homogeneity of the morphologies of the deposited Sn films, leading to the formation of smooth Sn coatings, the associated roughness of which was determined to be 7.642 nm. The Sn deposits' crystal structure was investigated using X-ray diffraction spectroscopy. 

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Main Subjects


1. Huang, X., et al., Study of tin electroplating process using electrochemical impedance and noise techniques. Journal of the Electrochemical Society, 2013. 160,P.D530, 
https://doi.org/10.1149/2.055311jes
 2. Sekar, R., et al., Effect of additives on electrodeposition of tin and its structural and corrosion behaviour. Journal of Applied Electrochemistry, 2010. 40,P.49-57, https://doi.org/10.1007/s10800-009-9963-6
3. Han, C., et al., Nucleation of Sn and Sn-Cu alloys on Pt during electrodeposition from Sn-citrate and Sn-Cu-citrate solutions. Electrochimica Acta, 2009. 54,P.3419-3427, https://doi.org/10.1016/j.electacta.2008.12.064
4. Pewnim, N. and S. Roy, Effect of fluorosurfactant on copper-tin reduction from methanesulphonic acid electrolyte. Transactions of the IMF, 2011. 89,P.206-209, https://doi.org/10.1179/174591911X13082997023918
5. Vieira, L., et al., Tin, bismuth, and tin-bismuth alloy electrodeposition from chlorometalate salts in deep eutectic solvents. ChemistryOpen, 2017. 6,P.393-401, https://doi.org/10.1002/open.201700045
6. Alesary, H.F., et al., Effect of sodium bromide on the electrodeposition of Sn, Cu, Ag and Ni from a deep eutectic solvent-based ionic liquid. Int J Electrochem Sci, 2019. 14,P.7116-7132,
https://doi.org/10.20964/2019.08.80
7. Tachikawa, N., et al., Electrochemistry of Sn (II)/Sn in a hydrophobic room-temperature ionic liquid. Electrochimica Acta, 2008. 53,P.6530-6534, 
https://doi.org/10.1016/j.electacta.2008.04.056
8. Leong, T.-I., et al., Electrochemistry of tin in the 1-ethyl-3-methylimidazolium dicyanamide room temperature ionic liquid. Electrochimica Acta, 2011. 56,P.3941-3946, https://doi.org/10.1016/j.electacta.2011.02.022
9. Zhang, Q., et al., Deep eutectic solvents: syntheses, properties and applications. Chemical Society Reviews, 2012. 41,P.7108-7146,
https://doi.org/10.1039/c2cs35178a
10. Shishov, A., et al., Application of deep eutectic solvents in analytical chemistry. A review. Microchemical Journal, 2017. 135,P.33-38, 
https://doi.org/10.1016/j.microc.2017.07.015
11. Alesary, H.F., et al., A comparative study of the effect of organic dopant ions on the electrochemical and chemical synthesis of the conducting polymers polyaniline, poly (o-toluidine) and poly (o-methoxyaniline). Chemical Papers, 2021. 75,P.5087-5101, https://doi.org/10.1007/s11696-020-01477-8
12. Alesary, H.F., et al., Influence of additives on the electrodeposition of zinc from a deep eutectic solvent. Electrochimica Acta, 2019. 304,P.118-130, https://doi.org/10.1016/j.electacta.2019.02.090
13. Al-Murshedi, A.Y., et al., Electrochemical fabrication of cobalt films in a choline chloride-ethylene glycol deep eutectic solvent containing water. Chemical Papers, 2020. 74,P.699-709, https://doi.org/10.1007/s11696-019-01025-z
14. Ismail, H.K., et al., Ion and solvent transfer of polyaniline films electrodeposited from deep eutectic solvents via EQCM. Journal of Solid State Electrochemistry, 2019. 23,P.3107-3121, https://doi.org/10.1007/s10008-019-04415-1
15. Lei, C., et al., Gamma-phase Zn-Ni alloy deposition by pulse-electroplating from a modified deep eutectic solution. Surface and Coatings Technology, 2020. 403,P.126434, https://doi.org/10.1016/j.surfcoat.2020.126434
16. Alesary, H.F., et al., Influence of different concentrations of nicotinic acid on the electrochemical fabrication of copper film from an ionic liquid based on the complexation of choline chloride-ethylene glycol. Journal of Electroanalytical Chemistry, 2021. 897,P.115581, https://doi.org/10.1016/j.jelechem.2021.115581
17. Mohammed, M.Q., et al. Comparative electrochemical behavior of poly (3-aminobenzoic acid) films in conventional and non-conventional solvents. in AIP Conference Proceedings. 2020. AIP Publishing LLC. https://doi.org/10.1063/5.0027520
18. Ismail, H.K., et al., Synthesis and characterisation of polyaniline and/or MoO2/graphite composites from deep eutectic solvents via chemical polymerisation. Journal of Polymer Research, 2019. 26,P.1-12, https://doi.org/10.1007/s10965-019-1732-6
19. Al-Murshedi, A.Y.M., et al. Thermophysical properties in deep eutectic solvents with/without water. in Journal of Physics: Conference Series. 2019. IOP Publishing. https://doi.org/10.1088/1742-6596/1294/5/052041
20. Alesary, H.F., et al., Effects of dopant ions on the properties of polyaniline conducting polymer. Oriental Journal of Chemistry, 2018. 34,P.2525, https://doi.org/10.13005/ojc/340539
21. Ismail, H.K., et al., Effect of Graphene Oxide and Temperature on Electrochemical Polymerization of Pyrrole and Its Stability Performance in a Novel Eutectic Solvent (Choline Chloride-Phenol) for Supercapacitor Applications. ACS omega, 2022, https://doi.org/10.1021/acsomega.2c03882
22. Ismail, H.K., Electrodeposition of a mirror zinc coating from a choline chloride-ethylene glycol-based deep eutectic solvent modified with methyl nicotinate. Journal of Electroanalytical Chemistry, 2020. 876,P.114737, https://doi.org/10.1016/j.jelechem.2020.114737
23. Mohammed, Z.J., et al., A Study of the Effects of Water on the Electrochemical Properties and Characterization of Co-Zn Alloys from a Deep Eutectic Solvent. Egyptian Journal of Chemistry, 2022. 65,P.1-2,
24. Gu, C., et al., Non-aqueous electrodeposition of porous tin-based film as an anode for lithium-ion battery. Journal of Power Sources, 2012. 214,P.200-207, https://doi.org/10.1016/j.jpowsour.2012.04.085
25. Salomé, S., et al., Tin electrodeposition from choline chloride based solvent: Influence of the hydrogen bond donors. Journal of Electroanalytical Chemistry, 2013. 703,P.80-87, https://doi.org/10.1016/j.jelechem.2013.05.007
26. Ghosh, S. and S. Roy, Characterization of tin films synthesized from ethaline deep eutectic solvent. Materials Science and Engineering: B, 2014. 190,P.104-110, https://doi.org/10.1016/j.mseb.2014.09.014
27. Cao, X., et al., Electrochemical behavior and electrodeposition of sn coating from choline chloride-urea deep eutectic solvents. Coatings, 2020. 10,P.1154, https://doi.org/10.3390/coatings10121154
28. Alesary, H.F., et al., Effects of additives on the electrodeposition of ZnSn alloys from choline chloride/ethylene glycol-based deep eutectic solvent. Journal of Electroanalytical Chemistry, 2020. 874,P.114517, https://doi.org/10.1016/j.jelechem.2020.114517
29. Wang, H., et al., Physical-chemical properties of nickel analogs ionic liquid based on choline chloride. Journal of Thermal Analysis and Calorimetry, 2013. 115,P.1779-1785, 
https://doi.org/10.1007/s10973-013-3398-3
30. Al-Esary, H.F.N., Influence of additives on electrodeposition of metals from deep eutectic solvents. 2017, University of Leicester. https://doi.org/10.1016/j.electacta.2019.02.090